- dicing cut
- <ic.prod> (separation of chips) ■ Trennschnitt m
English-german technical dictionary. 2013.
dicing cut
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Dicing — This article is about the food preparation technique. For other uses, see Dice (disambiguation). Dicing is a culinary knife cut in which the food item is cut into small blocks or dice. This may be done for aesthetic reasons or to create uniformly … Wikipedia
Dicing saw — File:Dicing blade.jpg Two dicing blades inside their cases A dicing saw is a kind of saw which employs a high speed spindle fitted with an extremely thin diamond blade or diamond wire to dice, cut, or groove semiconductor wafers, silicon, glass,… … Wikipedia
Dicing — Dice Dice (d[imac]s), v. t. [imp. & p. p. {Diced} (d[imac]st); p. pr. & vb. n. {Dicing}.] 1. (Cooking) To cut into small cubes; as, to slice and dice carrots. [PJC] 2. To ornament with squares, diamonds, or cubes. [1913 Webster] … The Collaborative International Dictionary of English
Wafer dicing — is the process by which individual silicon chips or integrated circuits on a silicon wafer are separated following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing (normally with a … Wikipedia
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Wafer (electronics) — Polished 12 and 6 silicon wafers. The flat cut into the right wafer indicates its doping and crystallographic orientation (see below) … Wikipedia
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Dice (disambiguation) — Dice are a polyhedral objects used in games for generating random numbers. Dice games themselves Dice, DICE, or dicing may also refer to: Dice Living, a way of life depicted in the novel The Dice Man by Luke Rhinehart DICE (compiler), a C… … Wikipedia
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